Beam On Oregon: Aperture Designs

Stencil Aperture Design

	Dogbone Opening: A modification that can be applied in two different situations. For fine pitch it reduces solder in the middle of the pad to reduce bridging but gives more volume on the ends for good fillets. It can also be used when reflowing double side SMT Connectors.
	Homebase Openings: The most common shape used when trying to keep paste away from the component body in order to eliminate solderballs when using a no-clean solderpaste.
	StepDown / Multilevel: The only cost/time effective method of printing different paste heights using the same stencil. Commonly used when dealing with CCGA's to prevent coplanarity issues.
	Epoxy Design: A service which has been provided and perfected since Beam On's inception. Stencil openings are designed to deposit just the right amount of glue to hold the components during wave solder process.
	Thru-Hole Reflow: Also called "Pin-In-Paste," stencil openings are designed for thru-hole assembly during reflow instead of wave solder. At Beam On we have the ability to incorporate this design with EtchDowns when large amounts of solder are required. For the intrepid, ask us about double stencil process for PTH reflow.
	Square: It's a square, so what? It's also the best shape to use when printing very small openings for MicroBGA's to optimize paste deposition.
	Backetch: Used to relieve for surface features that prevent the stencil from making adequate contact with the board such as barcode labels, tented vias, wire ink, etc. Also used for Dual Stencil Processes.
	Trapezoidal Walls: All stencils manufactured by Beam On, and to be honest, almost every other stencil company, have openings that are larger on the contact side than the squeegee side to enhance paste release.

Be sure to check out the equipment Beam On uses!
Stencil Equipment | Tooling Equipment